January 8, 2020
This is the fifth in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS-UK events. […]
October 30, 2019
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two […]
October 29, 2019
The Advanced Power Electronics Packaging Symposium, which will be held online from April 26 to 29, 2021, specifically addresses current market needs and corresponding technical developments […]
October 29, 2019
HiTEC 2021, which will be held online from April 26 to 29, 2021, continues the tradition of providing the leading biennial conference dedicated to the advancement […]
October 28, 2019
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference, which will be held online from April 26 to 29, 2021, brings together a diverse set of […]
October 9, 2019
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 23-24, 2022. MiNaPAD is […]
October 9, 2019
The 15th Advanced Technology Workshop on Micropackaging and Thermal Management will be held in La Rochelle from 5 to 6 February, 2020. The Workshop will present […]
August 19, 2019
The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. The conference is a major forum for […]
August 19, 2019
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 28-29, […]
August 19, 2019
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Topical Workshop on Additive Manufacturing and Printed Electronics on September 30, 2019, preceding IMAPS 2019 […]
August 19, 2019
Following the success of the Power Electronics Workshop organized over the past 10 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]
August 19, 2019
Microlectronics Packaging for Harsh Environments is an IMAPS-UK technical conference covering the latest developments for microelectronic devices used in space, defence, aerospace, medical, energy & exploration […]