March 28, 2019
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]
March 28, 2019
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 22-23, 2019. MiNaPAD […]
December 13, 2018
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the […]
December 13, 2018
The MicroTech 2019 Conference & Exhibition, organised by IMAPS-UK, focuses on the rapidly developing UK Microelectronics & Semiconductor Industry and applications for Power management components. Touching […]
November 15, 2018
The 15th Annual Device Packaging Conference (DPC 2019) will be held in Fountain Hills, Arizona, on March 4-7, 2019. The conference is a major forum for […]
November 15, 2018
The 52nd International Symposium on Microelectronics will take place in the Hynes Memorial Center in Boston from September 30th to October 3rd, 2019. The Technical Committee […]
November 15, 2018
The Advanced SiP 2019 is the world‘s largest Advanced System-in-Package (SiP) event. Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology from […]
September 17, 2018
The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. […]
September 17, 2018
Following the success of the Power Electronics Workshop organized over the past 9 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics and éolane, IMAPS-France […]
September 16, 2018
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]
September 16, 2018
MPACT 2018 Conference, organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year, it will […]
September 16, 2018
the 17th international Symposium on Microelectronics and Packaging (ISMP 2018) will be held at COEX convention center, Seoul, Korea, on October 24-26, 2018. This international conference […]