Who We Are…

The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics. Founded in 1967, IMAPS has professional members in 23 North American chapters and 21 international chapters.

IMAPS Europe comprises 13 independent local IMAPS Chapters that embrace the community of microelectronics packaging engineers throughout Europe. Their members number over 1500 individuals plus additional corporate members in some chapters. Membership is always local to a chapter.

The IMAPS European chapters organize national and international seminars, workshops and conferences, the flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events.

Latest News

  • EMPC 2019: Technical Program now online
    Headed by eminent keynotes, the programme comprising 29 technical sessions is a must for engineers and scientists to keep at the forefront of technology. This year’s […]
  • Benefit from early bird registration until April 19, 2019
    MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center from May 22-23, 2019. Register […]


EMPC 2019: Technical Program now online

22nd Microelectronics and Packaging Conference

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading […] more

16 Sep 2019 - 19 Sep 2019
Conference Center PISA Italy
4 Sep - 6 Sep 2019
Conference Centre (building D-20), Wrocław University of Science and Technology, Poland
30 Sep - 3 Oct 2019
Hynes Memorial Center, Boston, USA
30 Sep 2019
Hynes Convention Center, Boston, USA
17 Oct - 18 Oct 2019
Munich University of Applied Sciences, Munich, Germany
24 Oct - 25 Oct 2019
Brno University of Technology, FEEC, Department of Microelectronics, Czech Republic
28 Nov 2019
Satellite Applications Catapult, Didcot, United Kingdom
28 Nov 2019
GREMAN, Amphithéâtre du départment électronique et énergie, Tours, France
28 Jan - 29 Jan 2020
Westgate Hotel San Diego, San Diego, USA

DPC 2020

16th Annual Device Packaging Conference
2 Mar - 5 Mar 2020
WekoPa Resort Fountain Hills, Arizona, USA

Chapter News

  • 4th IMAPS Flash Conference 2018
    With pleasure we invite all prospective authors to participate in 4th IMAPS flash Conference 2018 which will be held at 25. - 26. October 2018 at Brno University of Technology. The conference will be organized by IMAPS CZ & SK in cooperation with CEITEC and it will be thematically...

Why become a member?

  • Member to member exchange
  • Expand your contacts
  • Events & Proceedings
  • Advancing Microelectronics
  • Affiliated Membership IMAPS NA
  • and more