Who We Are…
The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education and training, interaction with industry and networking amongst professionals and academics. Founded in 1967, IMAPS has professional members in 23 North American chapters and 21 international chapters.
IMAPS Europe comprises 13 independent local IMAPS Chapters that embrace the community of microelectronics packaging engineers throughout Europe. Their members number over 1500 individuals plus additional corporate members in some chapters. Membership is always local to a chapter.
The IMAPS European chapters organize national and international seminars, workshops and conferences, the flagship event being the EMPC, which is held every odd year interleaved with ESTC every even year with mutual access to both events.
- MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center from May 22-23, 2019. Register […]
- From 2019, the SMTconnect will have a new look. Running in parallel to the exhibition, the newly launched Technology Days will focus on mounting and connecting […]
EMPC 2019 – Pisa, Italy!22nd Microelectronics and Packaging Conference
The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading […] more
NordPac 2019The Nordic Conference on Microelectronics Packaging
Technical University of Denmark, Lyngby, Denmark
Advanced SiP 2019Conference and Exhibition on Advanced System in Package Technology
Monterey Marriott Hotel, Monterey, USA
HiTEN 2019International Conference and Exhibition on High Temperature Electronics Network
St. Anne’s College in the University of Oxford, Oxford, United Kingdom
Hynes Memorial Center, Boston, USA
Internet of things, Industrie 4.0, autonomous driving or smart grid: Innovations in these technological areas always require intelligent electronic systems. The symposium „Electronics and System Integration at Landshut University....
With pleasure we invite all prospective authors to participate in 4th IMAPS flash Conference 2018 which will be held at 25. - 26. October 2018 at Brno University of Technology. The conference will be organized by IMAPS CZ & SK in cooperation with CEITEC and it will be thematically...