Organised by IMAPS Nordic in cooperation with the IEEE Electronics Packaging Society Nordic, NordPac 2019 took place from 11 to 13 June 2019 on the campus […]

Headed by eminent keynotes, the programme comprising 29 technical sessions is a must for engineers and scientists to keep at the forefront of technology. This year’s […]

MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center from May 22-23, 2019. Register […]

From 2019, the SMTconnect will have a new look. Running in parallel to the exhibition, the newly launched Technology Days will focus on mounting and connecting […]