March 16, 2023

President of IMAPS Germany Martin Schneider-Ramelow is the new director of Fraunhofer IZM

With the approval of the Fraunhofer-Gesellschaft’s Scientific and Technical Council Prof. Martin Schneider-Ramelow, the president of IMAPS Germany, has received and accepted the call to be […]
January 11, 2023

The IMAPS Device Packaging Conference returns to Arizona!

The 19th DPC Conference will be held March 13-16, 2023, in Fountain Hills, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved […]
June 28, 2022

Our activities for the microelectronics community continue with vigour in 2022

October 18, 2021

We connect Chips to Systems

The years 2020 and 2021 were strange for all of us. Nevertheless, we continued to be keen to keep contact with and run events for our […]