October 27, 2017

Polish IMAPS Chapter successfully hosted first EMPC Conference in Eastern Europe

From September, 10 – 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of […]
October 27, 2017

Klaus Dieter Lang Receives The William D. Ashman Achievement Award

The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical […]
October 8, 2017

IMAPS honors Martin Schneider-Ramelow with Fellow of the Society Award

For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society […]
June 8, 2017

EMPC 2017 – Where East meets West

With well over 300 participants and together with its bi-annual co-conference ESTC, EMPC has established itself as THE trade event in Europe for microelectronic packaging. Next year’s […]