July 16, 2018

IMAPS/IEEE NordPac – A Look Back

This year’s Scandinavian packaging conference NordPac took place from June 12th to 14th in Oulu/Finland, bringing its approx. 60 attendees to a place where the sun never sets […]
July 2, 2018

Join us for the 22nd Microelectronics an Packaging Conference & Exhibition (EMPC 2019)

The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading […]
October 27, 2017

Polish IMAPS Chapter successfully hosted first EMPC Conference in Eastern Europe

From September, 10 – 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of […]
October 27, 2017

Klaus Dieter Lang Receives The William D. Ashman Achievement Award

The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical […]