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  • The IMAPS Device Packaging Conference returns to Arizona!

The IMAPS Device Packaging Conference returns to Arizona!

January 11, 2023

The 19th DPC Conference will be held March 13-16, 2023, in Fountain Hills, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly with a multi-faceted technical program and unique networking events.

For more information click here.

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  • TIE 2026 brings together Romania‘s microelectronics community
    August 6, 2026
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