TIE 2026 brings together Romania‘s microelectronics community

The 35th edition of Technologies of Interconnections in Electronics (TIE 2026), organized by the IMAPS Romania Chapter represented by APTE, took place from 22 to 25 April 2026 in Cluj-Napoca, Romania. Presented under the motto “Industry-Wide Student Challenges,” TIE 2026 continued its role as an industry-driven educational platform connecting students, universities, research communities, and electronics companies.

The event brought together students, researchers, academic staff, and industry professionals for four days dedicated to innovation in electronics, microelectronics, and electronic packaging. The program featured hands-on workshops, technical sessions, keynote presentations, industry-supported competitions, exhibitions, and networking activities designed to strengthen the bridge between academia and industry.

A highlight of this year’s edition was the launch of the TIE nano – Chip Implementation Challenge, a new initiative encouraging young engineers to explore advanced chip design and implementation. Participants worked with cutting-edge tools, received mentoring from experts, and showcased creative solutions to real-world engineering challenges.

With growing international participation and an expanded ecosystem of activities, including IPCEI-related workshops and multiple competitive tracks, TIE 2026 reaffirmed its role as a key European platform for developing semiconductor and electronics talent. APTE remains committed to supporting education, collaboration, and technological progress within the IMAPS community.