DPC 2023 will be held at the WeKoPa Resort and Conference Center, from March 13-16, 2023. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
Now in its 19th year, Device Packaging 2023 is the largest premier winter-spring conference for advanced packaging, featuring 3 concurrent technical tracks with more than 80 speakers and poster presentations. Full conference attendees will have access to: 2 networking lunches, GBC Plenary Session, 4 keynote speakers, poster session & happy hour, panel discussion, access to a sold out exhibition of 66 booths, interaction with 22 sponsoring companies, the all new DEI Roundtable Session, and invaluable networking at the welcome reception, exhibit hall reception, breaks, more. Attendees can add-on any of our 12 professional development courses on FOWLP, Flip Chip, Chiplets/HI, Wire Bond, 5G/6G, SiP and many others. Join the 500-600+ others that attend this conference each year and have selected DPC as THE advanced packaging conference to attend in Q1!