October 30, 2026
October 15, 2026
The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by […]
August 18, 2026
MicroTech 2027 is the Annual IMAPS-UK Conference. This In Person Conference combines invited Keynotes and presentations from leading Industrial Companies and Research Organisations. The Conference will […]
August 18, 2026
The RF, Microwave and Photonics Packaging (RaMPoP) Conference 2026 will take place on November 26, 2026, at the Compound Semiconductor Applications Catapult in Newport, United Kingdom. […]
June 23, 2026
We are pleased to open the call for papers of the 20th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La […]
April 1, 2026
The 47th IMAPS Poland Conference, held jointly with the 18th International Conference on Optical and Electronic Sensors (COE), will take place from September 20–23, 2026, in […]
February 18, 2026
Join us in Milan on May 5th for the ‘Advanced Packaging’ workshop! We invite you to submit your abstract and be part of the conversation by […]
February 18, 2026
The 12th IMAPS Flash Conference 2026 will take place on October 22–23, 2026, in Zlín, Czech Republic, under the theme “Comprehensive Semiconductor Analysis.” Organized by the […]
January 27, 2026
The 59th International Symposium on Microelectronics (IMAPS Symposium 2026), organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will take place from September 28 […]
January 27, 2026
The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) will take place from 9 to 11 September 2026 in Helsinki, Finland. As the flagship IEEE […]
January 26, 2026
The 25th International Conference on Electronics Packaging (ICEP-HBS2026) will be held at the International Conference Center Hiroshima from April 14 to 18, 2026. The conference will […]
December 18, 2025
In Fall 2026, IMAPS Germany will once again host its annual conference on current topics in electronics packaging and interconnection technology across all application areas. The […]