We are pleased to open the call for papers of the 20th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La […]
The 47th IMAPS Poland Conference, held jointly with the 18th International Conference on Optical and Electronic Sensors (COE), will take place from September 20–23, 2026, in […]
IMAPS flash Conference is the European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to […]
The 59th International Symposium on Microelectronics (IMAPS Symposium 2026), organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will take place from September 28 […]
The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) will take place from 9 to 11 September 2026 in Helsinki, Finland. As the flagship IEEE […]
The 25th International Conference on Electronics Packaging (ICEP-HBS2026) will be held at the International Conference Center Hiroshima from April 14 to 18, 2026. The conference will […]
In Fall 2026, IMAPS Germany will once again host its annual conference on current topics in electronics packaging and interconnection technology across all application areas. The […]
IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2026, in Stockholm, Sweden. The event brings together both […]
Digitalization and artificial intelligence are shaping many developments in both professional and everyday life. Whether it’s smartphones, computers, data and energy flows, or numerous innovations in […]
The “Electronic Assemblies and Printed Circuit Boards (EBL)” conference provides a high-level platform for professionals from industry, research, and development to discuss current trends, technologies, and […]