IEEE ESTC 2026
11th IEEE Electronics System-Integration Technology ConferenceThe 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) will take place from 9 to 11 September 2026 in Helsinki, Finland. As the flagship IEEE EPS conference in Europe, co-sponsored by IMAPS Europe, IEEE ESTC 2026 offers a premier platform for the electronics packaging and system integration community and will be the largest conference in the region in 2026.
This year’s IEEE ESTC Conference will feature 105 oral and 108 poster presentations highlighting new developments in advanced packaging, wafer-level packaging, reliability of electronic devices and power electronics, to name but a few topics. As in previous years, the conference papers will be published in the conference proceedings and in the IEEE Xplore database.
We are delighted to welcome five distinguished packaging experts as keynote speakers who will be presenting new findings from their respective areas of expertise.
Other highlights include eight professional development courses on the morning of the first conference day, an EPS HIR Workshop, Special Sessions on various subjects as well as a Panel Discussion.
Please note that changes in the program may still occur.
Why participate?
IEEE ESTC 2026 offers a high-quality conference program with inspiring keynotes, oral and poster presentations, Professional Development Courses (PDCs), special sessions, a panel discussion, and an accompanying exhibition. The conference also provides excellent opportunities for international exchange and networking with experts from academia and industry. All accepted contributions will be published in IEEE Xplore, ensuring high visibility for your work. To support young researchers, up to 20 IEEE ESTC Student Travel Awards will be granted to students with accepted papers or posters. In addition, exceptional papers and posters will be honored with the Best Paper Award and the Best Poster Paper Award, each including a €500 cash prize.