IMAPS Flash Conference

The 12th IMAPS Flash Conference 2026 will take place on October 22–23, 2026, in Zlín, Czech Republic, under the theme “Comprehensive Semiconductor Analysis.” Organized by the Czech and Slovak Chapter of the International Microelectronics and Packaging Society (IMAPS CZ&SK), in cooperation with Brno University of Technology, the Institute of Scientific Instruments, and Tomas Bata University, the conference brings together researchers, engineers, scientists, and industry professionals to exchange knowledge and discuss recent developments in microelectronics, semiconductor technologies, and advanced packaging.

The conference serves as a European platform for scientific exchange between established experts and early-career researchers from academia and industry. Its focus is on experimental and theoretical research, technological innovations, and industrial applications across the broad fields of electronics, microelectronic technologies, and packaging.

The 2026 edition will place particular emphasis on Comprehensive Semiconductor Analysis, highlighting the growing importance of interdisciplinary approaches to semiconductor research, characterization, integration, and reliability.

The technical programme will cover a broad range of topics, including:

• Electronic Assembly, Packaging and Advanced Integration: Innovative packaging solutions, assembly processes, and integration technologies for next-generation electronic systems.
• Joining, Interconnection and Interface Technologies: Advanced joining methods, interconnect materials, and interface engineering.
• Materials and Functional Structures for Microelectronics: Novel materials, functional layers, and manufacturing processes for semiconductor and packaging applications.
• Simulation, Modelling and Digital Design Tools: Multiphysics simulation, numerical modelling, thermal management, and digital design methodologies.
• Reliability, Testing and Characterization: Reliability assessment, failure analysis, advanced measurement techniques, and lifetime prediction.
• Sensors, Microsystems, Embedded and Control Systems: MEMS/NEMS technologies, sensor integration, embedded electronics, and intelligent control systems.
• Quantum, Photonics and Future Semiconductor Technologies: Emerging semiconductor devices, integrated photonics, quantum technologies, and future developments in microelectronics.

A particular highlight of the conference will be the Flash Poster Session, providing an interactive platform for researchers to present their work, receive feedback, and engage in discussions with experts from different disciplines.

In addition to technical presentations and scientific discussions, the conference offers valuable opportunities for networking, interdisciplinary collaboration, and knowledge exchange between academia and industry.