IMAPS Fall Conference
In Fall 2026, IMAPS Germany will once again host its annual conference on current topics in electronics packaging and interconnection technology across all application areas. The conference provides an important platform for professional exchange between industry and academia as well as between production and research, thereby supporting the safeguarding, strengthening, and further development of Germany as a business and technology location.
The conference focuses on the areas of design, modeling and simulation, materials and processes, system integration technologies, as well as quality and reliability.
As in previous years, a Best Presentation Award will also be presented in 2026.
IMAPS Germany is part of the International Microelectronics and Packaging Society (IMAPS) and has served as the central forum in Germany for all those involved in microelectronics and electronics packaging and interconnection technology since 1973. With around 250 members, IMAPS pursues three main objectives: linking science and practice, promoting information exchange among its members, and representing their interests in international committees and organizations.
Call for Abstracts
We are once again pleased to invite you to present and discuss your results on microelectronic packaging topics at our conference with representatives from industry and academia (20-minute presentation + discussion, slide deck for participants, no full paper required). Please submit your abstract by June 19, 2026 (approx. 200 words) for evaluation here. All information regarding the submission process can be found in our Call for Abstracts.
Registration
Registration for the event is now open: https://www.conftool.net/imaps-herbstkonferenz-2026. Please find below an overview of the participation fees:
- Non-members: €355
- Members: €230
- Speakers: €90
- Students: €40
- Exhibitors: €980
- Conference dinner (without participation in the conference): €85
No VAT will be charged on the ticket prices.