IMAPS Symposium 2026
The 59th International Symposium on Microelectronics (IMAPS Symposium 2026), organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will take place from September 28 to October 1, 2026, at the Encore Boston Harbor in Boston, Massachusetts, USA. Recognized as one of the industry’s leading international events, the symposium brings together experts, researchers, manufacturers, suppliers, and decision-makers from across the global microelectronics and advanced packaging community.
Held under the theme “Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics,” IMAPS Symposium 2026 will explore the latest innovations driving the next generation of electronic packaging technologies. The conference offers an outstanding platform for knowledge exchange, professional development, and networking, attracting both long-time industry professionals and hundreds of first-time attendees, including early-career engineers, researchers, and students.
The event begins on September 28 with Professional Development Courses, providing in-depth training on key technologies and emerging industry trends. From September 29 to October 1, attendees can participate in a comprehensive technical conference featuring keynote presentations, technical sessions, panel discussions, and industry presentations. A concurrent exhibition showcases the latest products, manufacturing solutions, materials, and technologies from leading companies throughout the microelectronics supply chain.
The technical program covers a broad range of cutting-edge topics, including:
- Heterogeneous Integration, Chiplets, High-Performance Computing (HPC), and AI Packaging
- Advanced Interconnect, Bumping, and Bonding Technologies
- Photonics and Co-Packaged Optics
- RF, Microwave, MEMS, Sensors, Flexible Electronics, and Power Electronics
- Wafer-Level and Fan-Out Packaging (WLCSP & FOWLP)
- Advanced Materials, Manufacturing Equipment, and Process Technologies
- Design, Modeling, Metrology, Chip-Package Interaction (CPI), and AI-enabled engineering solutions
With its world-class technical program, international exhibition, and extensive networking opportunities, IMAPS Symposium 2026 is a must-attend event for professionals looking to stay at the forefront of microelectronics packaging innovation, discover emerging technologies, and connect with industry leaders from around the world.