The 15th Annual Device Packaging Conference (DPC 2019) will be held in Fountain Hills, Arizona, on March 4-7, 2019. The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
The following four topical workshop tracks are planned:
– 3D Applications & Technologies
– Flip Chip, Wafer Level Packaging & Fan-Out
– Engineered Micro Systems/ Devices (including MEMS, Sensors & 3D Printing)
– Automotive Packaging
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase products and services to key decision making professionals in the industry. For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 4th, preceding the technical conference.