APEPS 2021

The Advanced Power Electronics Packaging Symposium, which will be held online from April 26 to 29, 2021, specifically addresses current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The symposium emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on their novelty and innovative contributions to the industry knowledge.

Abstracts are solicited in the following areas:

• Market Drivers
• Multi-Die Packaging
• Mobile and Handheld Devices and the Internet-of-Things (IoT)
• Wireless and Telecom Infrastructure
• Power Semiconductor Thermal Components, Systems, and Solutions
• Military/ Aerospace
• System-Level Cooling
• Data Center Cooling
• Liquid cooling, Phase-change, and Refrigeration
• Thermal Interface Materials (TIMs) and Testing
• CTE-Matching and High Thermal Conductivity Materials

Those wishing to present at the symposium must submit a 500+ word abstract electronically until January 13, 2021. Abstracts can be uploaded here.

New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning!