The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Topical Workshop on Additive Manufacturing and Printed Electronics on September 30, 2019, preceding IMAPS 2019 Boston – the 52nd International Symposium on Microelectronics. Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable. The workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and will exploit additive approaches to advance microelectronic packaging. The program covers the following topics: printable electronic materials, the options for manufacturing/ printing and the applications of printed and flexible electronics.
If you are interested in participating in the event, please register here. The deadline for the early bird price is August 29th, 2019.