HiTEC 2021 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2021 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.
Papers will be presented on, but not limited to, the following subjects:
Applications: Geothermal, Oil well, logging, Automotive, Military/Aerospace, Space, etc.
Device Technologies: Si, SOI, SiC, Diamond, GaN, GaAs, Contacts, Dielectrics
MEMS and Sensors: Vibration, Pressure, Seismic, etc.
Packaging: Materials, Processing, Solders/Brazes, PC Boards, Wire Bonding, Flip Chip, Insulation, Thermal Management
Circuits: Analog, Digital, Power, Wireless, Optical
Energy Sources: Batteries, Nuclear, Fuel Cells, etc.
Passives: Resistors, Inductors, Capacitors, Oscillators, Connectors
Reliability: Failure Mechanisms, Experimental and Modeling Results
Those wishing to present a paper at the HiTEC 2021 Conference must submit a 500+ word abstract electronically until October 31st, 2020. Abstracts can be uploaded here.
Companies wishing to sponsor this conference or exhibit, please contact Brian Schieman at firstname.lastname@example.org for more information.
New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning!