HiTEC 2021, which will be held online from April 26 to 29, 2021, continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2021 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.
The conference will be covering the following subjects:
Applications: Geothermal, Oil well, logging, Automotive, Military/Aerospace, Space, etc.
Device Technologies: Si, SOI, SiC, Diamond, GaN, GaAs, Contacts, Dielectrics
MEMS and Sensors: Vibration, Pressure, Seismic, etc.
Packaging: Materials, Processing, Solders/Brazes, PC Boards, Wire Bonding, Flip Chip, Insulation, Thermal Management
Circuits: Analog, Digital, Power, Wireless, Optical
Energy Sources: Batteries, Nuclear, Fuel Cells, etc.
Passives: Resistors, Inductors, Capacitors, Oscillators, Connectors
Reliability: Failure Mechanisms, Experimental and Modeling Results
New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning! You can register for the event here.