The 25th International Conference on Electronics Packaging (ICEP-HBS2026) will be held at the International Conference Center Hiroshima from April 14 to 18, 2026. The conference will […]

In Fall 2026, IMAPS Germany will once again host its annual conference on current topics in electronics packaging and interconnection technology across all application areas. The […]

IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2026, in Stockholm, Sweden. The event brings together both […]