April 16, 2025
The 22nd Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the […]
January 14, 2025
The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ( IMAPS) and held in Boston, Massachusetts. This year’s program […]
January 14, 2025
IMAPS (US) High Temperature, CICMT, and Power Packaging Conferences come together for a great opportunity for you…..one location, one registration, and three times the content, networking, […]
October 17, 2024
MAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2025, in Copenhagen, Denmark. The event brings together both […]
October 10, 2024
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The […]
October 10, 2024
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and […]
August 14, 2024
The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the […]
July 16, 2024
DPC 2025 will be held at the WeKoPa Resort and Conference Center, from March 3-6, 2025. It is an international event organized by the International Microelectronics […]
June 25, 2024
We are pleased to open the call for papers of the 18th Advanced Technology Workshop on Micropackaging and Thermal Management that will be held in La […]
June 14, 2024
The 46th IMAPS Poland Conference will be held at the Qubus Hotel Gdańsk, Poland from September 22-25 September 2024. The conference will be covering the following […]
May 7, 2024
Pack4EU’s core objective is to assess the current status of packaging, assembly, and test facilities in Europe. Additionally, it aims to analyze the evolving needs of […]
May 2, 2024
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on May 8-9 in Boston-Woburn. The Conference […]