June 3, 2019
Headed by eminent keynotes, the programme comprising 29 technical sessions is a must for engineers and scientists to keep at the forefront of technology. This year’s […]
April 2, 2019
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center from May 22-23, 2019. Register […]
December 3, 2018
From 2019, the SMTconnect will have a new look. Running in parallel to the exhibition, the newly launched Technology Days will focus on mounting and connecting […]
October 28, 2018
We are pleased to announce the launch of our new website! Our aim was to offers our viewers a user-friendly, easy to navigate new platform, allowing […]
July 16, 2018
This year’s Scandinavian packaging conference NordPac took place from June 12th to 14th in Oulu/Finland, bringing its approx. 60 attendees to a place where the sun never sets […]
July 2, 2018
The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading […]
October 27, 2017
From September, 10 – 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of […]
October 27, 2017
The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical […]
October 8, 2017
For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society […]
June 8, 2017
With well over 300 participants and together with its bi-annual co-conference ESTC, EMPC has established itself as THE trade event in Europe for microelectronic packaging. Next year’s […]