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EMPC®2021

August 16, 2021

The European Microelectronics and Packaging Conference and Exhibition, EMPC2021, is ready to deliver the latest in packaging and microelectronics developments and news to the world. As Covid19 is still a complicating factor for travel, the event will be held online from September 13 – 16.

The program includes three fantastic short courses on the 13th;

  • MEMS Sensors and Actuators by Prof. Gabor Harsanyi
  • Implications of New Semiconductor-Trends for IC-Packages by Tanja Braun and Michael Töpper
  • Achieving High Reliability of Lead-Free Solder Joints – Materials Considerations by Ning-Cheng Lee

The actual conference and exhibition starts on the 14th and the program includes, five keynotes, one invited speaker and 72 technical papers split into 16 sessions.

On the 14th, you will be able to see some of our sponsors and exhibitors present their line of products and services.

Please register now to be part of this exciting conference!

 

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