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March 19, 2024
March 19, 2024

The 24th European Microelectronics & Packaging Conference – The proceedings are now online!

UK, 11-14 September 2023 With 5 keynotes, 4 short courses, 69 oral presentations in 20 sessions and 18 posters, EMPC 2023 provided an exciting and diverse […]
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October 31, 2023
October 31, 2023

The 24th European Microelectronics & Packaging Conference – an event to remember!

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October 31, 2023
October 31, 2023

IMAPS 2023 – a resounding success

The 56th International Symposium on Microelectronics (IMAPS 2023) took place in San Diego, California, this year, attracting nearly 800 participants from around the world. In keynote […]
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March 16, 2023
March 16, 2023

President of IMAPS Germany Martin Schneider-Ramelow is the new director of Fraunhofer IZM

With the approval of the Fraunhofer-Gesellschaft’s Scientific and Technical Council Prof. Martin Schneider-Ramelow, the president of IMAPS Germany, has received and accepted the call to be […]
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Recent News

  • TIE 2026 brings together Romania‘s microelectronics community
  • EMPC 2025 – A great success
  • ICEP24 in Japan
  • IMAPS and ISHM – serving the microelectronics community over the decades
  • The 24th European Microelectronics & Packaging Conference – The proceedings are now online!

Latest News

  • TIE 2026 brings together Romania‘s microelectronics community
    August 6, 2026
  • EMPC 2025 – A great success
    September 6, 2025
  • ICEP24 in Japan
    May 22, 2024
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  • TIE 2026 brings together Romania‘s microelectronics community
    August 6, 2026
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    September 6, 2025

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