From September, 10 – 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of […]

The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical […]

For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society […]

With well over 300 participants and together with its bi-annual co-conference ESTC, EMPC has established itself as THE trade event in Europe for microelectronic packaging. Next year’s […]