For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) during the 49th International Symposium on Microelectronics that took place in Pasadena, USA, from Oct. 10 – 14, 2016.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies worldwide. The Fellow of the Society Award is the highest distinction IMAPS can bestow on a member.
Prof. Schneider-Ramelow has made significant scientific contributions in the field of microelectronic packaging, particularly with regard to the quality and reliability of wire bonds.
Over the years Martin Schneider-Ramelow has been involved with IMAPS in many ways. He has been Chair of IMAPS Germany since 2009 and has made increasing the membership base his particular focus over this period… and very successfully so, as Germany has the largest European chapter with approximately 300 members.
In September 2015 Martin Schneider-Ramelow was also voted Chair of the European Liaison Committee (ELC) of IMAPS Europe, which means that until 2017 at least he will be responsible for IMAPS both at the German and the European level