From September, 10 – 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of Warsaw. With 3 tracks and 72 oral and 25 poster presentations it was a truly immersive experience for the 250 conference delegates participating.
The organisers were particularly pleased by the variety of conference participants. Attendees came from 20 different countries and in almost equal parts from both industry and academia, and based on the networking observed on the conference floor and at the social events, it seems everyone went home with new contacts, insights and inspiration.
A particular highlight of the event was the conference dinner which took place in the big hall of the Physics Department on Tuesday. Live music and good food were an excellent backdrop for catching up with colleagues and some delegates even ventured out onto the dance floor.
The Best Paper winner was Fabrice F. C. Duval with his paper about “Impact of the combination of a stress buffer layer and a wafer level underfill on 3D IC assembly using thermal compression bonding”. The Best Poster Award went to Yongyin Kim and his co-authors for their paper on „Fabrication of dry-patching superhydrophobic flexible platform for HySiF (hybrid system in flexible) applications”. Our congratulations go to both teams – well done, everybody.
The next EMPC Conference will be hosted by the Italian IMAPS chapter from September 16 – 19, 2019, in the lovely city of Pisa. More information can be found at: http://www.imaps-italy.it/in-primo-piano/empc-2019-italy.html
Last, the organisers would like to extend our thanks to all keynote speakers, presenters, session chairs, committee members, exhibitors, sponsors and our organizing team for the part they played in this truly memorable event.