EMPC 2017 – Where East meets West

With well over 300 participants and together with its bi-annual co-conference ESTC, EMPC has established itself as THE trade event in Europe for microelectronic packaging. Next year’s EMPC will be held at the University of Warsaw from September 10 – 13, 2017. As organizers, the Polish IMAPS Chapter cordially invites you to join them as a visitor, exhibitor or sponsor.

Since it is the first time for the conference to be organized in an eastern part of europe, we look forward to bring together the entire microelectronics supply chain. Technical and marketing professionals should complete the variety of participants, who also move on an important platform for dialogue between industry and academia.

The conference is dedicated to the growth of the community, focusing on developments of microelectronics and packaging technologies of the present and future, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Reliability and much more. There will be:

– 3 Keynote Sessions

– 14 oral sessions

– 2 poster sessions

The conference offers a great possibility to hear about all the cutting-edge microelectronics news and networking in a relaxed atmosphere during the gala dinner.

We are looking forward to meeting you at the Warsaw University of Technology!

For further information please go to www.empc2017.pl