The past year, so out of ordinary, has just ended…
Hoping that you are all well, I would like to wish you a 2021 full of life and positive things. Following up some email exchanges with Alexandre and Nihal I would like to share with you my overview about last year IMAPS Europe chapters’ activities and in the next future. Please feel free to share my comments in your Chapter Community if you deem it appropriate
Last year months have passed by without us being able to carry out many of the projects we had planned with such enthusiasm and commitment. Many Conferences have been cancelled, or moved to 2021, or beyond. However in spite of the Pandemia in 2020 we also saw several successful events being held with unusual approaches. Please refer to the “News from the Chapters of IMAPS-Europe” but just to name some of them:
Many of the above events were offered for free or at very advantageous conditions to IMAPS Members and Students. Although the interpersonal relationship is largely lacking, these online events have demonstrated the ability to facilitate access to a large European audience and to be an interesting alternative to live events.
In 2021 we are not giving up and we will come back with new ideas and initiatives. We need to adopt new formulas and develop innovative technologies but … this is our daily business, and our IMAPS Community is certainly used to such challenges! This year the key event of our Society will be the European Microelectronics and Packaging Conference – EMPC2021. It will be held from 13th to 16th September in Gothenburg, Sweden. Plans are well advanced for a face to face Conference and Exhibition, but in the event that the COVID pandemic will not allow it, an innovative “on line” back-up solution has been prepared that will enable social networking for participants, speakers and exhibitors.
The above programme shows that in spite of these difficult times, the IMAPS-Europe Chapters are lively and active. The European Liaison Committee – ELC – is strongly committed to support all co-ordinated Chapter’s initiatives for the advancement and sharing of Microelectronics Packaging Technologies. Above all, we are confident that the engineering community will support all the events as usual – by sharing Innovation, we all benefit!
Once again on behalf of all ELC board I wish you a happy, healthy, innovative, creative and successful new year!
President IMAPS-Europe, Chair ELC