November 15, 2018
The Advanced SiP 2019 is the world‘s largest Advanced System-in-Package (SiP) event. Speakers, sponsors, exhibitors and attendees will focus on the insights of SiP technology from […]
September 17, 2018
The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. […]
September 17, 2018
Following the success of the Power Electronics Workshop organized over the past 9 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics and éolane, IMAPS-France […]
September 16, 2018
ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]