The webinar held by John Park from Cadence Design Systems will take place on June 17th, 2020 from 12.00 p.m. to 12.45 p.m. (Eastern time). Semiconductor […]
Join IMAPS for a virtual workshop featuring six technical speakers from Henkel, Mentor, Indium, Momentive, Hexagon and Materials Center GmbH on a variety of thermal management […]
This is the fourth in a series of fundamentals of electronics packaging tutorials organised by IMAPS-UK to describe various aspects of the production of microelectronic assemblies. […]
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package […]
The 17th Annual Device Packaging Conference will be held online on April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and […]
For the sixth time, Fraunhofer IZM is organizing the world’s largest conference on the environment in electronics under the title “Electronics Goes Green” (EGG). This year’s […]
This workshop brings together an array of Industry experts and practitioners to present a comprehensive overview of Quality and Reliability aspects required for the development and […]
This is the fifth in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS-UK events. […]
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two […]
The Advanced Power Electronics Packaging Symposium, which will be held online from April 26 to 29, 2021, specifically addresses current market needs and corresponding technical developments […]