The 53rd International Symposium on Microelectronics, IMAPS 2020, will be hosted in a virtual environment from October 5-8. The IMAPS 2020 organizing committee is excited to […]
The European Microelectronics and Packaging Conference (EMPC) 2021 offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this […]
Due to the ongoing exceptional circumstances resulting from the global Covid-19 pandemic, IMAPS-UK has decided to move the MicroTech 2020 online on Wednesday 16th September 2020. […]
The webinar held by John Park from Cadence Design Systems will take place on June 17th, 2020 from 12.00 p.m. to 12.45 p.m. (Eastern time). Semiconductor […]
Join IMAPS for a virtual workshop featuring six technical speakers from Henkel, Mentor, Indium, Momentive, Hexagon and Materials Center GmbH on a variety of thermal management […]
This is the fourth in a series of fundamentals of electronics packaging tutorials organised by IMAPS-UK to describe various aspects of the production of microelectronic assemblies. […]
IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package […]
The 17th Annual Device Packaging Conference will be held online on April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and […]
For the sixth time, Fraunhofer IZM is organizing the world’s largest conference on the environment in electronics under the title “Electronics Goes Green” (EGG). This year’s […]
This workshop brings together an array of Industry experts and practitioners to present a comprehensive overview of Quality and Reliability aspects required for the development and […]