May 28, 2020

Virtual Workshop: Thermal Management

Join IMAPS for a virtual workshop featuring six technical speakers from Henkel, Mentor, Indium, Momentive, Hexagon and Materials Center GmbH on a variety of thermal management […]
May 14, 2020

Advanced SiP 2021

IMAPS established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2021 combines the IMAPS System-in Package […]
May 14, 2020

Device Packaging 2021

The 17th Annual Device Packaging Conference will be held online on April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and […]
March 25, 2020

Electronics Goes Green 2020+

For the sixth time, Fraunhofer IZM is organizing the world’s largest conference on the environment in electronics under the title “Electronics Goes Green” (EGG). This year’s […]
January 8, 2020

RelQual 2020 Workshop

This workshop brings together an array of Industry experts and practitioners to present a comprehensive overview of Quality and Reliability aspects required for the development and […]
January 8, 2020

Webinar on Harsh Environment Electronics

This is the fifth in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS-UK events. […]
October 30, 2019

ESTC 2020 goes virtual!

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two […]
October 29, 2019

APEPS 2021

The Advanced Power Electronics Packaging Symposium, which will be held online from April 26 to 29, 2021, specifically addresses current market needs and corresponding technical developments […]