Device Packaging 2021

17th International Conference and Exhibition on Device Packaging

The 17th Annual Device Packaging Conference will be held online on April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

If you would like to help shape the program, you may submit an abstract on the following topics:

3D Integration
Fan-Out, Wafer Level Packaging & Flip Chip
Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Application

Abstracts can still be uploaded online here until January 13, 2021.