Headed by eminent keynotes, the programme comprising 29 technical sessions is a must for engineers and scientists to keep at the forefront of technology. This year’s conference program is now online. Martin Schneider-Ramelow, President of IMAPS Germany and Past President of IMAPS Europe, is delighted with this year’s program. “The Scientific Committee has put together an excellent program again, covering all aspects of packaging and interconnection technologies. I am particularly pleased that the organizers got industry involved with an entire poster session devoted to industrial contributions”.
Also online are the slide and poster specifications for the speakers. Excellent papers accepted by eminent international referees are scheduled to be presented in the conference sessions comprising:
– Advanced Packaging
– Embedded Electronics & Smart Textiles
– Green Electronics
– Interconnection Technologies
– Manufacturing Technologies
– Nano Technologies
– Power & Thermal Management
– Reliability & Quality
– Substrate Technologies.
Many international companies are taking part in EMPC 2019 as exhibitors or sponsors. Here you can learn of innovative equipment, techniques and services to benefit your organisation.
Informative short courses preceding the conference provide the opportunity to learn and progress your professional development.
Leading research institutes are invited to participate in the EMPC Global R&D village. In addition to the scheduled conference and exhibition the Global R&D Village is a dedicated area where the research organizations can present their activities and future projects.
If golf is your sport, stay through to 20th September to play at the lovely location of Versilia Golf, Forte dei Marmi (LU): http://www.empc2019.org/social-events.html.
Set in Pisa in the wonderful Tuscany District, where else should you be in September 2019? So, click on the EMPC website, register now and attend this great event.