International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
International Microelectronics and Packaging Society Europe
The European Microelectronics and Packaging Conference (EMPC) is the established international forum for engineers working in the field and others wanting to learn from this leading […]
From September, 10 – 13, 2017 the Polish IMAPS chapter hosted the European Microelectronic Packaging Conference (EMPC) in the beautiful rooms of the Technical University of […]
The International Microelectronics Assembly and Packaging Society (IMAPS) awards the William D. Ashman Achievement Award once every year to an individual who has made significant technical […]
For his years of dedication and support in various leadership roles Martin Schneider-Ramelow was honored as a Fellow of the International Microelectronics Assembly and Packaging Society […]