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October 31, 2023
October 31, 2023

IMAPS 2023 – a resounding success

The 56th International Symposium on Microelectronics (IMAPS 2023) took place in San Diego, California, this year, attracting nearly 800 participants from around the world. In keynote […]
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March 16, 2023
March 16, 2023

President of IMAPS Germany Martin Schneider-Ramelow is the new director of Fraunhofer IZM

With the approval of the Fraunhofer-Gesellschaft’s Scientific and Technical Council Prof. Martin Schneider-Ramelow, the president of IMAPS Germany, has received and accepted the call to be […]
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January 11, 2023
January 11, 2023

The IMAPS Device Packaging Conference returns to Arizona!

The 19th DPC Conference will be held March 13-16, 2023, in Fountain Hills, Arizona. This esteemed event brings together industry engineers, researchers and top experts involved […]
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June 28, 2022
June 28, 2022

Our activities for the microelectronics community continue with vigour in 2022

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Recent News

  • ICEP24 in Japan
  • IMAPS and ISHM – serving the microelectronics community over the decades
  • The 24th European Microelectronics & Packaging Conference – The proceedings are now online!
  • The 24th European Microelectronics & Packaging Conference – an event to remember!
  • IMAPS 2023 – a resounding success

Latest News

  • ICEP24 in Japan
    May 22, 2024
  • IMAPS and ISHM – serving the microelectronics community over the decades
    April 4, 2024
  • The 24th European Microelectronics & Packaging Conference – The proceedings are now online!
    March 19, 2024
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  • ICEP24 in Japan
    May 22, 2024
  • IMAPS and ISHM – serving the microelectronics community over the decades
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