ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]

The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International […]

The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will […]