This years IMAPS Italy worshop for advances technology in microelectronic sensor packaging will take place in the Politecnico of Milano Consiglio Hall on May 14th. Further […]

On April 17, 2024, the 4th Electronics and System Integration Symposium (ESI 2024) will take place at Landshut University of Applied Sciences. The ESI symposium offers […]

From March 5 to 6, 2024, the 12th DVS/GMM Symposium will open its doors in the Schwabenhalle Fellbach. Visitors can expect current lectures on the topic […]

Every autumn, IMAPS Germany organizes an annual conference on current topics in packaging technology in all fields of application. IMAPS Germany would like to see the […]