The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International […]
The Centre for Power Electronics (CPE) Annual Conference will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will […]
MicroTech 2024 is the Annual IMAPS-UK Conference which will focus on Making a Space for Advanced Packaging. This In Person Conference combines invited Keynotes and presentations […]
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]
The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference […]
The conference will be held in English language in presence, for up to 100 people. Access is free and subject to availability, mandatory registration at the […]
IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finland. The event brings together both […]
Following the success of the Power Electronics Workshop organized over the past 13 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]
The 58th International Conference on Microelectronics, Devices and Materials, MIDEM 2023, continues the tradition of annual international conferences organized by the MIDEM Society. These conferences have always attracted […]
We are pleased to open the call for papers of the 17th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in Poitiers […]
The 45th IMAPS Poland Conference 2023 will be held from September 24 to 27, 2023. The Conference is organized by IMAPS Poland Chapter and Rzeszów University […]
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 18-20 in Albuquerque, New Mexico. […]