The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 18-20 in Albuquerque, New Mexico. The Conference will bring together technologists from a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power electronics development. Attendees and Exhibitors will be exposed to a variety of power applications and packaging solutions from board level integration to power packaging for distributed energy systems to encourage cross pollination and insight of current and emerging market challenges and opportunities for collaboration.
POWER PACKAGING TECHNOLOGIES
|Advanced/Sustainable Materials||Board Mount Power||Multiphysics Modeling|
|Substrates & Module Designs||Granular Power||Co-Design Simulation|
|Embedding Technologies||Data Center Power||Characterization Techniques|
|Thermal Management||Embedded Components||Physics of Failure Analysis|
|Manufacturing Technologies||Integrated Capacitors & Magnetics||Roadmapping|
|Power Interposers||Energy Storage||Reliability|
|Additive Manufacturing||Automotive Electronics|
|Attachment/Bonding/Joining Technologies||EV Charging|
|Planar Interconnects||Power Flip Chip|
|Insulation Materials/Strategies||Distributed Energy Interfaces|
Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the conference, should submit a 250+ word abstract at www.imaps.org/powerpack immediately. Speakers are required to pay a reduced registration fee. Papers are not required.