January 27, 2021
This presentation will outline a novel design methodology that overcomes many of today’s challenges for co-designing and co-analyzing multi-chip(let) packages. Speaker John Park of Cadence Design […]
January 27, 2021
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Live Virtual Workshop on Advanced Packaging and Business Outlook for Medical Microelectronics.. The workshop will […]
December 8, 2020
This Research Showcase covers “Recent Advances on Reliability and Gate Driving of WBG Power Electronics” with presentations by Warwick, Nottingham, Bristol, Newcastle, Edinburgh and Aalborg Universities. […]
December 8, 2020
This Semiconductor Packaging Workshop on 11 February 2021 brings together an array of electronics packaging experts and practitioners to present a comprehensive review of key semiconductor […]