The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.The program includes keynote presentations, Professional Development Courses, technical presentations and Posters.
The 5 technical tracks will include the following:
1: Manufacturing Optimization
2: Wafer Level/Panel Level (Advanced RDL)
3: High Performance / High Reliability
4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)
5: Advanced Process & Materials (Enabling Tech.)
For further information about the program and keynote speakers click here.