The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2021 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.
The 5 technical tracks will include the following:
1: Manufacturing Optimization
2: Wafer Level/Panel Level (Advanced RDL)
3: High Performance / High Reliability
4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)
5: Advanced Process & Materials (Enabling Tech.)
The deadline for abstract submission is July 1, 2021. The start for exhibit sales is May 3, 2021.