EMPC 2019 – the flagship conference of IMAPS Europe

December 9, 2019

The 22nd European Microelectronics and Packaging Conference (EMPC 2019) was held in Pisa, hosted by the Italian Chapter IMAPS Italy. By all measures: technical, commercial, financial and social, EMPC 2019 was a success for IMAPS Europe and for those who participated.

377 persons attended EMPC 2019 including those who attended the technical conference and those who visited just the exhibition. In addition 31 persons attended the Short Courses (Professional Development Courses). EMPC 2019 had 40 exhibition booths populated by 88 exhibitors representing 50 companies and 5 R&D exhibits from universities and research institutes.

: Attending the exhibition

: R&D Village

The technical programme comprised 112 oral presentations including lecture presentations and poster presentations plus 6 keynote talks by eminent international presenters.

: Opening Keynote by Laurent Herard, Group VP – Head of Back End Manufacturing & Technology R&D @ STMicroelectronics

: Q&A at a Technical Presentation

All submissions to IMAPS Europe conferences are evaluated by panels of international referees having technical expertise spanning the topics of EMPC. So, the standards are set very high. Submissions are judged by the referees to be best suited to be presented as either oral lectures or orally presented posters. Equal value is given whether the presentation is by slides or posters. The poster sessions are coordinated parallel to the oral lecture sessions. The poster orientation and the poster hall are organised to enable the presenters to present their posters in scheduled time slots to the attending audience. The effectiveness of oral poster presentations is obvious – as operated by IMAPS Europe for more than 20 years.

Attending the Poster Session