March 15, 2021

Designing the Future of Additive Manufactured Electronics

This Technical Workshop organised by the Design for Additive Manufacturing Network and IMAPS-UK covers “Designing the Future of Additive Manufactured Electronics” including presentations by The University of Leeds, The Manufacturing Technology Centre […]
July 14, 2020

EMPC 2021

The European Microelectronics and Packaging Conference (EMPC) 2021 offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this […]