EMPC 2021

The European Microelectronics and Packaging Conference (EMPC) 2021 in Gothenburg, Sweden offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 13 to 16 September at the Lindholmen Conference Centre, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.

The EMPC will focus on the following topics:

• Advanced Packaging: 3D integration, System-in Packages, FI- and FO-WLP, innovative interconnects, circuit solutions, Panel level packaging, Substrate and Interposer Technologies, emerging Heterogenous Integration Technologies
• Advanced packaging for MEMS & sensors: Sensors, actuators and RF systems
• Electronics Reliability & Quality: Methodology, Predictive maintenance, Novel reliability test methods., Modelling, Statistical reliability analysis and life models, Failure analysis and material characterization
• Green Technologies: Recycling, supply chain, low power computing
• Harsh environment applications: Aerospace, automotive, rail, washable wearables, smart farming, drilling, HTHP (high temperature and high pressure) O&G wells, geothermal energy and process industry
• Materials & Processes: Manufacturing and assembly technologies, new materials, compatibility, enabling materials, nano-materials and processes
• Medical electronics: Implantable devices, miniaturization, neural interfaces, validation, new trends, reliability of implanted electronics, sensors for (implantable) medical devices
• Opto-electronics: Packaging, light sources, detectors, photonic integrated circuits based on III-V/Si technology platforms, emerging materials, applications
• Power electronics: Packaging, Thermal management, Wide Bandgap applications, Energy-conversion technologies
• Printed electronics: Materials and processes, Flexible, Structural, Applications (automotive, energy, medical, wearable and others)

Call for Papers:
EMPC 2021 committee is well prepared for running the conference either as an Online or, if safety allows, Face-to-Face event. The abstract deadline has been extended: We are now awaiting your abstract to be received latest on February 9, 2021. Please check the Call for papers here and take an opportunity to present your research and innovations. Encourage your colleagues and teams to do the same! This event will be a stepping stone in recovering academia and industry!

You are welcome to submit abstract(s) presenting new developments and knowledge in the above mentioned areas. The abstract should have 300-500 words and may include images. The abstract template can be downloaded here. First, create your profile at www.empc2021.org and follow the instructions for submitting the abstract.

Sponsors & Exhibitors:
The conference will host its exhibition from September 14 to 15, 2021 giving your company the opportunity to get in touch with the world’s leading packaging scientists, engineers and companies. If you are interested in participating as an exhibitor, you can find all necessary information here.