EMPC 2021

The European Microelectronics and Packaging Conference (EMPC) 2021 offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. In the present circumstances with the Covid 19 situation the EMPC 2021 will be held online from September 13 to 16, 2021.

Trippus will be used as the conference platform, which is based on Zoom. In addition to our program, we will organise break-out rooms that are accessible for mingling and networking during breaks and lunches.

The EMPC will focus on the following topics:

• Advanced Packaging: 3D integration, System-in Packages, FI- and FO-WLP, innovative interconnects, circuit solutions, Panel level packaging, Substrate and Interposer Technologies, emerging Heterogenous Integration Technologies
• Advanced packaging for MEMS & sensors: Sensors, actuators and RF systems
• Electronics Reliability & Quality: Methodology, Predictive maintenance, Novel reliability test methods., Modelling, Statistical reliability analysis and life models, Failure analysis and material characterization
• Green Technologies: Recycling, supply chain, low power computing
• Harsh environment applications: Aerospace, automotive, rail, washable wearables, smart farming, drilling, HTHP (high temperature and high pressure) O&G wells, geothermal energy and process industry
• Materials & Processes: Manufacturing and assembly technologies, new materials, compatibility, enabling materials, nano-materials and processes
• Medical electronics: Implantable devices, miniaturization, neural interfaces, validation, new trends, reliability of implanted electronics, sensors for (implantable) medical devices
• Opto-electronics: Packaging, light sources, detectors, photonic integrated circuits based on III-V/Si technology platforms, emerging materials, applications
• Power electronics: Packaging, Thermal management, Wide Bandgap applications, Energy-conversion technologies
• Printed electronics: Materials and processes, Flexible, Structural, Applications (automotive, energy, medical, wearable and others)

We are also particularly looking forward to our keynotes, consisting of five top-class experts, whom we were able to win over for presentations on important topics in our industry.  All keynote speakers can be found here. In addition, the program includes nearly 80 expert presentations, a start-up outreach, and the opportunity for exhibitors to introduce themselves. If you are interested in participating as an exhibitor, you can find all necessary information here.