EMPC 2021

The European Microelectronics and Packaging Conference (EMPC) 2021 in Gothenburg, Sweden offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 13 to 17 September at the Lindholmen Conference Centre, an ideal venue which includes excellent lecture auditoria, exhibition space and a great social venue. The event will be complemented by social events for which IMAPS has a great tradition.

The EMPC will focus on the following topics:

• Advanced Packaging
• Advanced packaging for MEMS & sensors
• Electronics Reliability & Quality
• Green Technologies
• Harsh environment applications
• Materials & Processes
• Medical electronics
• Opto-electronics
• Power electronics
• Printed electronics

Call for Papers:
You are welcome to submit abstract(s) presenting new developments and knowledge in the above mentioned areas. The abstract should have 300-500 words and may include images. It should be submitted by January 19, 2021. First, create your profile at www.empc2021.org and follow the instructions for submitting the abstract. The site will be open for submission in September 2020.

Sponsors & Exhibitors:
The conference will host its exhibition from September 14 to 16, 2021 giving your company the opportunity to get in touch with the world’s leading packaging scientists, engineers and companies. If you are interested in participating as an exhibitor, you can find all necessary information here.