The 44th International Spring Seminar on Electronics Technology is an European forum for the exchange of scientific information between young and senior scientists from academic communities and electronics industries. The seminar objective is to exchange experience in the utilization of advanced electronics, electronics manufacturing, micro and nanoelectronics, research, development, manufacturing, testing and teaching, international cooperation and student exchanges, supporting collaboration among junior and senior scientists from Europe and other continents. The theme of the upcoming 44th ISSE conference is “Advancements in Microelectronics Packaging for Harsh Environment”.
Due to the Coronavirus pandemic the ISSE 2021 will be held once more as a virtual web conference and will be hosted in Dresden, Germany, by the Institute of Electronics Packaging Technology (IAVT) and the Centre for Microtechnical Manufacturing (ZmP) at TU Dresden.
The organizers are happy to announce that participation in ISSE 2021 will be free for authors and registered participants. This web-based conference replaces our standard of a five-day conference, usually including a national cultural programme. In-person meetings, presentations, discussions are replaced by online presentations distributed over two and a half days. We believe that this new form of conference will not reduce its traditions and high standard. Though we do not expect online meetups to displace all physical conferences, nor to replace networking of meeting in person. However, in the time of this pandemic crisis online meetings have great potential to reduce air travel, costs of conference attendance and impact on families, and to democratize access to knowledge on a global scale.
The deadline for registration, as well as for submission of full-lenght papers is April 16, 2021. You can register for the seminar here and download a paper template here.