Every autumn, IMAPS Germany organizes an annual conference on current topics in packaging technology in all fields of application. IMAPS Germany would like to see the annual conference as an important platform for the necessary close-meshed technical discussion between industry and academia as well as production and research in order to secure, strengthen and further develop Germany as a business location. We therefore cordially invite you again this year to present your results on the following microelectronic packaging topics at our conference in front of representatives from industry and science and to discuss them together (presentation 20 minutes + discussion, set of slides for participants, no full paper required):
Design, modeling, simulation
– Electrical and electromagnetic design
– Thermal and thermomechanical design
– Design for manufacturing and testing
– HF design and 3D design
System integration technologies
– Wafer level packaging (CSP, SiP, …)
– Substrate level packaging (system on board, embedding, …)
– MEMS / sensor packaging
– Optoelectronic packaging
– 3D packaging
Materials and processes
– Substrate materials and surface layer systems
– Production of wiring carriers
– Connection technologies (flip chip, CoB, SMT, embedding, …)
– Protection, potting and encapsulation processes and materials
– Nanomaterials
Quality and reliability
– Process monitoring / test strategies
– Test systems
– Thermomechanical reliability
– Reliability under combined stresses
– Lifetime monitoring and prediction