IMAPS Autumn Conference 2024

Every autumn, IMAPS Germany organizes an annual conference on current topics in packaging technology in all fields of application. IMAPS Germany would like to see the annual conference as an important platform for the necessary close-meshed technical discussion between industry and academia as well as production and research in order to secure, strengthen and further develop Germany as a business location. The program, which you can find here, is covering the following topics:

Design, modeling, simulation
– Electrical and electromagnetic design
– Thermal and thermomechanical design
– Design for manufacturing and testing
– HF design and 3D design

System integration technologies
– Wafer level packaging (CSP, SiP, …)
– Substrate level packaging (system on board, embedding, …)
– MEMS / sensor packaging
– Optoelectronic packaging
– 3D packaging

Materials and processes
– Substrate materials and surface layer systems
– Production of wiring carriers
– Connection technologies (flip chip, CoB, SMT, embedding, …)
– Protection, potting and encapsulation processes and materials
– Nanomaterials

Quality and reliability
– Process monitoring / test strategies
– Test systems
– Thermomechanical reliability
– Reliability under combined stresses
– Lifetime monitoring and prediction