Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.
Advanced Packaging
-2.xD/3D, TSV/TGV
-Substrates/interposers/RDL
-Fan-out/in packaging
-Wafer/panel level packaging
-Automotive and IoT applications
-High-performance computing
-Heterogeneous integration technologies
-Chiplet packaging
-Hybrid bonding
-Other related technologies
Emerging Technologies
-Health/medical care and cosmetics devices
-Stretchable/flexible electronics
-Sensor and MEMS/NEMS/MOEMS packaging
-Batteries and eco-friendly devices
-Advanced MEMS/NEMS/MOEMS technologies
-Packaging for quantum computing
-Other related technologies
High-Speed, Wireless & Components
-3D-printed components
-Antennas, RFs, and sensor modules
-Highspeed applications (5G, LTE etc.)
-Automotive and IoT applications
-Other related technologies
Power Electronics
-Power device and module fabrication (HEMT, diode, IPM etc.)
-Advanced Inverter & converter
-Super capacitor
-Harsh environment tolerant device & module
-Si-based MOSFET, BJT, IGBT
-Other relating technologies
Thermal Management
-Advanced cooling technologies
-Thermal management structures (heat sinks, pipes, etc.)
-Simulation, measurement, and evaluation methods
-Other related technologies
Interconnections
-Interconnection methods (flip-chip, wire-bonding etc.)
-2.xD/3D, TSV/TGV, fan-out/in interconnections
-Embedded systems
-Power electronics interconnections
-Bio/medical and eco-friendly devices
-Hybrid bonding
-Other related technologies
Materials and Processes
-Homo/heterogeneous bonding/assembly
-Substrates, interposers and panels
-Metallic materials & processes (plating, soldering etc.)
-Organic semiconductors (OLED, OFET, OPV etc.)
-Power electronic/battery materials & processes
-Optoelectronic materials & processes
-Additive manufacturing (compound, paste, 3D printing etc.)
-Die to Wafer, Wafer to Wafer, Debonding
-Other related technologies
Design, Modeling, and Reliability
-2.xD/3D, TSV/TGV, WLCSP, Fan-out/in
-Advanced reliability evaluation (PDfR etc.)
-High performance board design
-Novel test methods and life models (LCA, TCAD etc.)
-Other related technologies
Optoelectronics
-3D/silicon photonics technologies
-Optical connectors, waveguides, & transceivers
-Device fabrication (LED, laser, sensor, etc.)
-Mid/on-board module fabrication
-Optical wafer/chip-scale packaging
-Co-packaged optics
-Other related technologies
Other Upcoming Technologies
-New system concept & design
-Any other topics related to ICEP scope