ICEP 2024

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS Japan Chapter, and iMAPS. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, thermal management.

Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world.

Advanced Packaging
-2.xD/3D, TSV/TGV
-Substrates/interposers/RDL
-Fan-out/in packaging
-Wafer/panel level packaging
-Automotive and IoT applications
-High-performance computing
-Heterogeneous integration technologies
-Chiplet packaging
-Hybrid bonding
-Other related technologies

Emerging Technologies
-Health/medical care and cosmetics devices
-Stretchable/flexible electronics
-Sensor and MEMS/NEMS/MOEMS packaging
-Batteries and eco-friendly devices
-Advanced MEMS/NEMS/MOEMS technologies
-Packaging for quantum computing
-Other related technologies

High-Speed, Wireless & Components
-3D-printed components
-Antennas, RFs, and sensor modules
-Highspeed applications (5G, LTE etc.)
-Automotive and IoT applications
-Other related technologies

Power Electronics
-Power device and module fabrication (HEMT, diode, IPM etc.)
-Advanced Inverter & converter
-Super capacitor
-Harsh environment tolerant device & module
-Si-based MOSFET, BJT, IGBT
-Other relating technologies

Thermal Management
-Advanced cooling technologies
-Thermal management structures (heat sinks, pipes, etc.)
-Simulation, measurement, and evaluation methods
-Other related technologies

Interconnections
-Interconnection methods (flip-chip, wire-bonding etc.)
-2.xD/3D, TSV/TGV, fan-out/in interconnections
-Embedded systems
-Power electronics interconnections
-Bio/medical and eco-friendly devices
-Hybrid bonding
-Other related technologies

Materials and Processes
-Homo/heterogeneous bonding/assembly
-Substrates, interposers and panels
-Metallic materials & processes (plating, soldering etc.)
-Organic semiconductors (OLED, OFET, OPV etc.)
-Power electronic/battery materials & processes
-Optoelectronic materials & processes
-Additive manufacturing (compound, paste, 3D printing etc.)
-Die to Wafer, Wafer to Wafer, Debonding
-Other related technologies

Design, Modeling, and Reliability
-2.xD/3D, TSV/TGV, WLCSP, Fan-out/in
-Advanced reliability evaluation (PDfR etc.)
-High performance board design
-Novel test methods and life models (LCA, TCAD etc.)
-Other related technologies

Optoelectronics
-3D/silicon photonics technologies
-Optical connectors, waveguides, & transceivers
-Device fabrication (LED, laser, sensor, etc.)
-Mid/on-board module fabrication
-Optical wafer/chip-scale packaging
-Co-packaged optics
-Other related technologies
Other Upcoming Technologies
-New system concept & design
-Any other topics related to ICEP scope