Electronic Assemblies and Printed Circuit Boards (EBL)

The “Electronic Assemblies and Printed Circuit Boards (EBL)” conference provides a high-level platform for professionals from industry, research, and development to discuss current trends, technologies, and challenges in the field of electronic assembly and PCB manufacturing.

This year’s focus lies on the resilience of European value chains, the integration of state-of-the-art technologies such as embedded components, high-frequency and power electronics, and the central question: How can Europe secure its competitiveness in this strategically important sector?

In a series of engaging presentations, workshops, and technical exhibitions, topics such as digitalization and Industry 4.0, process simulation, new materials, thermal management, testing and reliability, as well as applications in mobility, energy technology, medical engineering, and IoT will be addressed.

In addition to established industry players, young master’s students are also encouraged to participate through the EBL Young Talent Award, which recognizes outstanding and innovative academic work.