November 21, 2023
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC congress center from June 19-20, 2024. MiNaPAD is […]
November 16, 2023
The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) is the premier international event in the field of electronics packaging and system integration. The conference […]
October 9, 2023
The conference will be held in English language in presence, for up to 100 people. Access is free and subject to availability, mandatory registration at the […]
September 21, 2023
IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finland. The event brings together both […]