NordPac 2026
IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2026, in Stockholm, Sweden. The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, packaging, integration, reliability testing, PCB design, assembly and manufacturing of electronics, optics, electronics in health tech, materials, Artificial Intelligence (AI), and Internet of Things (IoT) in electronics. This is the 62st event organised by IMAPS Nordic chapter, and we hope you will celebrate the milestone with us. So mark the dates 09-11 June 2026 in your calendar today!
Conference Topics
NordPac covers a broad range of current and future-oriented topics, including:
- Advanced microelectronics and packaging technologies
- Optoelectronics and photonics packaging
- Sintegration and design
- Reliability testing and quality assurance
- Materials and manufacturing processes
- Medical electronics
- Artificial Intelligence (AI) and Internet of Things (IoT) in electronics
- Thermal management and wearable technologies
Program Highlights
Participants can expect:
- Technical sessions featuring peer-reviewed papers
- Keynote presentations from leading industry experts
- Panel discussions on emerging trends
- Workshops and seminars
- A technical exhibition showcasing innovative products and solutions
Call for Exhibitors
It is our pleasure to announce Exhibitor opportunities for Nordic Conference and Exhibition on Microelectronics and Packaging, NordPac 2026.
NordPac offers you a combination of interesting technical sessions with the latest news in the field and an interactive exhibition. The exhibition enables direct onsite interaction between participants. The welcome reception, coffee breaks, and the conference dinner are great platforms for networking with your academic and industry colleagues. We have received positive feedback on creating open and warm atmosphere in our events.