The IMAPS Germany Spring Seminar will take place on March 17, 2026, at the Haus der Wirtschaft in Stuttgart, Germany. Under the theme “Innovative Packaging Solutions – Even for Small Production Volumes”, the event will focus on the latest approaches and technologies for modern packaging concepts. Expert presentations will provide valuable insights for developers and manufacturers alike.
Below is a sample overview of the technical program:
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Mr. Kai Werum and Mr. Maximilian Barth (Hahn-Schickard) will present a talk on “Film Assisted Transfer Molding as a Flexible Chip Packaging Platform.”
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Mr. Marc Dreissigacker (AEMtec) will speak on “Advanced Flip Chip Assembly – Strategies and Interconnect Formation.”
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Dr. Julius Komma will give a presentation entitled “LTCC-Based Packaging Solutions for Miniaturized MEMS Infrared Emitters.”
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D. Stier and K.-F. Becker (Fraunhofer IZM, Berlin) will present on “Development of a Jet-Dispensing Process for a Novel Nano-Ag Sinter Paste for Pressureless Sintering of Miniaturized Optoelectronic Components.”
Would you like to attend the IMAPS Seminar in Stuttgart or submit a presentation? Please use the following link to register:
https://www.conftool.net/imaps-fruehjahrsseminar-2026/index.php?page=index#menu
Further information about the seminar and details on the venue are also available via the registration link above.