IMAPS Spring Seminar (German)

Innovative Packaging Solutions – Even for Small Quantities

Co-organizers

The IMAPS Germany Spring Seminar will take place on March 17, 2026, at the Haus der Wirtschaft in Stuttgart, Germany. Under the theme “Innovative Packaging Solutions – Even for Small Production Volumes”, the event will focus on the latest approaches and technologies for modern packaging concepts. Expert presentations will provide valuable insights for developers and manufacturers alike.

Below is a sample overview of the technical program:

Mr. Kai Werum and Mr. Maximilian Barth (Hahn-Schickard) will present a talk on “Film Assisted Transfer Molding as a Flexible Chip Packaging Platform.”
Mr. Marc Dreissigacker (AEMtec) will speak on “Advanced Flip Chip Assembly – Strategies and Interconnect Formation.”
Dr. Julius Komma will give a presentation entitled “LTCC-Based Packaging Solutions for Miniaturized MEMS Infrared Emitters.”
D. Stier and K.-F. Becker (Fraunhofer IZM, Berlin) will present on “Development of a Jet-Dispensing Process for a Novel Nano-Ag Sinter Paste for Pressureless Sintering of Miniaturized Optoelectronic Components.”

Would you like to attend the IMAPS Seminar in Stuttgart or submit a presentation? Please use the following link to register:

https://www.conftool.net/imaps-fruehjahrsseminar-2026/index.php?page=index#menu

Further information about the seminar and details on the venue are also available via the registration link above.

Program:

Time
08:00 AM – 08:45 AM	Registration of participants
08:45 AM – 09:10 AM	Martin Schneider‑Ramelow	IMAPS Germany	Welcome by the 1st Chairman of IMAPS Germany e.V.
	Karl‑Peter Fritz	Hahn-Schickard	Welcome by the Director of the Hahn-Schickard Institute for Microstructural Engineering
	t. b. a.	Ministry of Economic Affairs, Labour and Tourism, Baden-Württemberg	Greeting from the Ministry
09:10 AM – 09:35 AM	Michael Warber	IMS Chips	Flexible Packaging‑Strategien für kleine Stückzahlen am Beispiel FlexPacFAM
09:35 AM – 10:00 AM	Maximilian Barth	Hahn‑Schickard	Film Assisted Transfer Molding als flexible Chip‑Packaging Plattform
10:00 AM – 10:25 AM	Stefan Koch	Tesat	Innovative Packaging‑Lösungen für die Raumfahrt – aktuelle Bedarfe und branchenspezifische Herausforderungen
10:25 AM – 10:50 AM	Richard Noack	XFAB	t. b. a.
10:50 AM – 11:20 AM	Coffee break and exhibition
11:20 AM – 11:45 AM	Ulrich Knoch	Advantest Europe	Need for speed and desity, Chip Packaging drives cost down and performance up
11:45 AM – 12:10 PM	Marc Dreissigacker	AEMtec	Advanced Flip Chip Assembly – Strategies and Interconnect Formation
12:10 PM – 12:35 PM	Christian Kempter	Rohde & Schwarz	Packaging für Hochfrequenz-Applikationen, Anforderungen und aktuelle Lösungsansätze aus industrieller Perspektive
12:35 PM – 01:00 PM	Jan Buchholz Aline Friedrich	IMST	6G‑Takeoff: Phased‑Array‑Antenne für das Ka‑Band
01:00 PM – 02:15 PM	Lunch break and exhibition
02:15 PM – 02:40 PM	Julius Komma	MicroHybrid	LTCC Based Packaging Solutions for Miniaturized MEMS Infrared Emitter
02:40 PM – 03:05 PM	Marcus Babin	Fraunhofer IOF	Packaging Solutions for Waveguide Chips
03:05 PM – 03:30 PM	Linus Daniel Stier Karl Friedrich Becker	Fraunhofer IZM	Entwicklung eines Jet-Dispensing Prozesses für eine neuartige Nano Ag Sinterpaste für das drucklose Sintern von miniaturisierten opto-elektronischen Komponenten
03:30 PM – 03:55 PM	Silke Bramlage	Baker Hughes	Electrical Component Autoclave Testing for Harsh Environments
03:55 PM – 04:10 PM	Martin Schneider‑Ramelow	IMAPS Germany	Closing remarks and outlook by the 1st Chairman of IMAPS Germany e.V.